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ReVera, Inc.
President and Chief Operating Officer
ReVera, Inc. is a leading provider of next generation metrology used to monitor and control films and critical layers deployed in semiconductor manufacturing processes. Customers including Samsung, Toshiba, TSMC, AMD, and Fujitsu, utilize these near line fab tools to provide unprecedented capability in materials metrology. The company was established in 2004 as a management-led spinout from Physical Electronics, a subsidiary of High Voltage Engineering. ReVera's products replace traditional optical-based technologies with next generation X-Ray based technology to address the challenges of smaller, more complex devices. The company is gaining traction with an impressive list of semiconductor manufacturers and is poised to continue this forward momentum.
ReVera's products utilize X-Ray photoelectron spectroscopy (XPS), a powerful technology that has been optimized to provide automation, speed, and reliability required in today's advanced semiconductor production environments. XPS is uniquely suited for the move to thinner films and smaller features, actually improving in performance at each technology node. ReVera's proprietary XPS technology goes beyond established lab techniques to provide real-time materials metrology capabilities and is configured to meet the demanding requirements of both development and production. ReVera's use of a non-destructive focused X-Ray beam, stable detection, and robust software algorithms results in repeatability, long term stability, and tool-to-tool matching comparable to conventional optical based tools. However, unlike conventional optical tools that use indirect modeling techniques to derive materials parameters, XPS provides a direct, unambiguous measurement of thickness and composition, assuring accurate and repeatable results for a broad range of films. ReVera's other patented technology is its zMAX depth distribution technology. zMAX provides precise and accurate in-line determination of the distribution of critical elements, such as nitrogen depth distribution in process conditions.
ReVera's core product is VeraFlex. This is a flexible, product wafer, non-destructive system that meets the increasing demands for advanced materials metrology. It provides the capabilities needed to address ultra thin film and atomic level materials requirements for next generation semiconductor production. VeraFlex capabilities include the ability to measure thickness, composition, profile, bonding states, interface quality, and surface condition. VeraFlex provides the flexibility necessary to efficiently and effectively address the full spectrum of real world challenges of advanced semiconductor manufacturing. It is meeting customer requirements for reliability, full factory automation and software robustness, hardware for next generation extendibility and ease of use. Installed and operating in production fabs, VeraFlex monitors, measures and controls critical materials processes at 65 nm, 45 nm and beyond.
Next generation tools to be released later this year will enable higher throughput, greater precision and reliability, increasing ReVera's price/performance advantage. ReVera has raised $21.2M in 3 rounds with Crosslink Capital, ATA Ventures and industry luminaries on the ReVera Board leading the investments. ReVera has approximately 40 employees and is headquartered in Sunnyvale, CA.
The qualified candidate will have the following:
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